Applied Microengineering
Unit 8 Library Avenue Harwell Science & Innovation Campus, Didcot OX11 0SG
+441235833934
Contacts
Unit 8 Library Avenue Harwell Science & Innovation Campus, Didcot OX11 0SG
Description
3D Interconnect aligned wafer bonding machines and wafer bonding service at Harwell Oxfordshire UK
Applied Microengineering Ltd (AML) are specialists in 3D Interconnect aligned wafer bonding and manufacture wafer bonding machines and provide wafer bonding services at Harwell in Oxfordshire UK
Features
- Wheelchair-accessible entrance
Map
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